Precision to perfection: 
     ➔ Thick-film Hybrid Technology

Packaging of Integrated Circuits

Packaging of integrated circuits is known as thick-film hybrid technology for the production of electronic circuits, where discrete and integrated components are mounted on an alumina ceramic substrate. By screen printing conductor tracks, insulating layers and resistive layers are applied onto the insulating and good heat-conductive substrate and baked in each case after printing and drying at 850 °C. The printed resistors can then be adjusted by laser trimming for precise references.

Different Contacting Methods

With the available range of interconnect materials based on gold, silver and platinum, different contacting method are possible - from soldering bonding over up to bonding with high precision, reproducibility and reliability. Important parameters for the assessment of the technological level: The minimum achievable feature sizes for interconnects and multi-layer structure, the alignment accuracy as well as a low printing error rate.

Advantages of this Technology

The technical advantages of the thick-film hybrid technology lie mainly in the combinations of components of different manufacturing techniques, combined with good insulation and thermal conductivity of the ceramic and the high reliability
of the assembled modules, achievable even at high temperatures.